KEY-207 Wafer Cutting Cleaning Agent
Product Highlights
Compliant with RoHS and REACH environmental directives | Reduce friction and heat during the cutting process | Improve cutting precision |
Extend the life of cutting tools | To prevent silicon wafers from cracking and splintering | Optimize waste management and maintain cleanliness |
Scope of application
KEY-207 wafer dicing cleaning agent is suitable for cleaning various wafers, LEDs, silicon wafers, and ceramic substrates during the dicing process. It can be diluted with water at a ratio of 1:800~1000. During the recycling process, the original solution needs to be replenished periodically. After long-term recycling, the clear liquid on the top can be used again after settling.
Features
How to use
Mix KEY-207 wafer cutting cleaning agent and deionized water evenly to prepare a working solution with a mass ratio of 1:800~1000 deionized water. After a period of cleaning, the cleaning power will decrease due to the increase of residue in the cleaning agent, and the cleanliness of the cleaned parts will deteriorate. Depending on the actual use, the cleaning agent in the tank needs to be added or replaced regularly (depending on the number of parts to be cleaned).
Physicochemical parameters
Appearance | Liquid |
Density | 0.995±0.030 g/cm³ (20℃) |
pH | 7.00±2.00 |
REACH | PASS |
RoHS | PASS |
Halogen content(ppm) | ND |
Packaging specifications
18L、20L、50L、100L、150L、200L、250L
Precautions
Transportation and storage
Transport as non-hazardous chemicals and non-corrosive chemicals.
Store in a cool, dry place away from light and heat, and in an airtight container.
Shelf life is 12 months when sealed.
Single packages must not be stacked more than two layers, and the bottom layer must be secured with a non-slip tray to prevent squeezing, deformation, or tipping.