KEY-204 Soldering Flux Cleaning Agent
Product Highlights
Zero Ozone Depletion Potential (ODP) | RoHS PASS | REACH PASS |
High cleaning power | Suitable for a variety of cleaning processes | No residue |
Broad material compatibility | Low volatile organic compounds(VOC) | Security |
Scope of application
This product is suitable for post-soldering cleaning of PCBA and cleaning of SMT printing screens; it can also be used for cleaning misprinted or incorrectly printed solder paste, glue, and soldering equipment; it has no corrosive effect on metal and plastic products; it can be used with various cleaning processes such as ultrasonic, spray, and manual cleaning.
Features
Physicochemical parameters
Appearance | Colorless and transparent liquid |
Density (g/cm3@20℃) | 0.800±0.020 g/cm3 (20℃) |
Boiling range | ≤130.0 ℃(Final boiling point) |
ODS | PASS |
RoHS | PASS |
Halogen content(ppm) | PASS |
REACH | PASS |
Storage temperature | 5.0~35.0 ℃ |
How to use
Precautions
After removing the portion of this product for use, the lid must be tightly secured to prevent the cleaning agent from evaporating.
Used cleaning agent must not be stored in the same container as unused cleaning agent. Once opened, if any cleaning agent remains in the container, it must not be left exposed to air; the lid should be tightly screwed on promptly.
Keep containers holding cleaning agents clean to prevent contamination from dirt or other substances, which may compromise product quality.
Before use, test for compatibility and solubility with printed silk screens, plastic materials, and related components.
Ensure adequate ventilation at the work site as cleaning agents are highly volatile.
Refer to the product's MSDS for detailed safety precautions and protective measures.
Packaging specifications
20L、50L、100L、150L、200L
Transportation and storage
Keep sealed, avoid direct sunlight and high heat.
The product is sealed and has a 12-month warranty period.